I have never heard of US cleaning causing cracked solder joints. I have used US for thousands of assemblies with BGAs, flipchips and uBGA and CSP components, and have never had any such thing happen. Perhaps I was lucky. Do you have any documentation to support that general statement? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Edwards Sent: Tuesday, August 02, 2005 9:42 PM To: [log in to unmask] Subject: Re: [TN] Question on cleaning boards with BGA. Never use an ultrasonic cleaning system with BGAs unless you want to generate cracked solder joints... Assuming your ECN is at the former label location which is why you need complete adhesive removal... find out from your label supplier what type of adhesive they are using and have them suggest something... We use an alcohol/glycol/water mix to remove most label adhesives... Paul Edwards Surface Art Engineering -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David Harman Sent: Tuesday, August 02, 2005 4:58 PM To: [log in to unmask] Subject: [TN] Question on cleaning boards with BGA. We are remanufacturing (reworking some of product) due to an ECR release. We apply a label with non-conductive adhesive that once removed leaves adhesive on the PCBA. This adhesive prevents the board from passing due to not making contact. The current process requires an operator to use IPA and a soft scrub to remove it. This process is time consuming. My CM has suggested that we ultrasonic the boards using S-10 solvent. My boards have BGAs, interconnect pins, and switches along with the normal SMT parts. Will using this s-10 solvent in an ultrasonic cleaner work, and will it not cause any reliability issues with BGAs or other parts on the boards? Anyone have any other suggestions for auto cleaning my boards to remove the adhesive. We use the no clean process. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------