Hi Everyone,

We are starting to redesign a product for RoHS compliance and one of our engineers has a concern. Due to the higher oven temps, he is afraid that excess warpage may occur to the board and large components, particularly the BGA's, and the resulting stress will lead to failures. He is considering increasing the thickness of the board, which would be an expensive proposition. Our largest BGA is a 19 x 19, 357 pin 1.27mm pitch part on a 7" x 9" .062" board. I know that a number of you have been working with lead free for a while. Have you had a need to increase the thickness of the board?

Thank you, 
Paul Black 
Manufacturing Engineer 
Kronos 
E-mail: [log in to unmask] 

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