Hi Everyone, We are starting to redesign a product for RoHS compliance and one of our engineers has a concern. Due to the higher oven temps, he is afraid that excess warpage may occur to the board and large components, particularly the BGA's, and the resulting stress will lead to failures. He is considering increasing the thickness of the board, which would be an expensive proposition. Our largest BGA is a 19 x 19, 357 pin 1.27mm pitch part on a 7" x 9" .062" board. I know that a number of you have been working with lead free for a while. Have you had a need to increase the thickness of the board? Thank you, Paul Black Manufacturing Engineer Kronos E-mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------