Hi Vladimir,
You are correct.
I have never seen an overstress failure of a solder joint that involved voids
in the solder joint bulk volume. I have seen creep-fatigue failures in SJs
with voids that did not involve the voids at all, or that went through the
voids, but were not caused by them. I have even seen SJs with cracks in them where
the cracks stopped at a void.
Overstress failures invariably involve the interfaces of solder joints where
for a variety of reasons really weak 'links' were created; that includes
interfacial failures due to Kirkendall voids.

Regards,
Werner Engelmaier

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