Doug,
Nicely put. You must have started on the Mountain Dew early today.
Regards,
George
George M. Wenger, Reliability Engineer
Andrew Corporation
40 Technology Drive
Warren, NJ 07059
(908) 546-4531 or (732) 309-8964 (Cell)
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Thursday, July 28, 2005 9:12 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.
Whoa. Back up the trolley. All boards have handling and storage
issues. Maybe not from a solderability perspective but certainly from a
cleanliness perspective.
Never make all encompassing statements, which, come to think of it, is
an all encompassing statement........
Doug Pauls
Phil Nutting
<PNutting@KAISERS
YSTEMS.COM>
To
Sent by: TechNet [log in to unmask]
<[log in to unmask]>
cc
Subject
07/28/2005 08:03 Re: [TN] RoHs board surface
AM recommendations.
Please respond to
TechNet E-Mail
Forum
<[log in to unmask]>
; Please respond
to
Phil Nutting
<PNutting@KAISERS
YSTEMS.COM>
And ENIG has no handling and storage issues like Immersion Silver and
Immersion Tin.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
Sent: Thursday, July 28, 2005 8:49 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.
If you are talking about PWB metallization, I would recommend ENIG. It
is compatible with both Tin/Lead and Lead-free.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos
Sent: Thursday, July 28, 2005 8:27 AM
To: [log in to unmask]
Subject: [TN] RoHs board surface recommendations.
Good Day TecNetters.
Does anybody out there have Board surface recommendations for a RoHs
process ?
A matrix would be preferred. I don't seem to recall seeing any such type
of document or discussions on TechNet so any help would be greatly
appreciated.
Barry
Western Electronics.
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