Doug, Nicely put. You must have started on the Mountain Dew early today. Regards, George George M. Wenger, Reliability Engineer Andrew Corporation 40 Technology Drive Warren, NJ 07059 (908) 546-4531 or (732) 309-8964 (Cell) -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls Sent: Thursday, July 28, 2005 9:12 AM To: [log in to unmask] Subject: Re: [TN] RoHs board surface recommendations. Whoa. Back up the trolley. All boards have handling and storage issues. Maybe not from a solderability perspective but certainly from a cleanliness perspective. Never make all encompassing statements, which, come to think of it, is an all encompassing statement........ Doug Pauls Phil Nutting <PNutting@KAISERS YSTEMS.COM> To Sent by: TechNet [log in to unmask] <[log in to unmask]> cc Subject 07/28/2005 08:03 Re: [TN] RoHs board surface AM recommendations. Please respond to TechNet E-Mail Forum <[log in to unmask]> ; Please respond to Phil Nutting <PNutting@KAISERS YSTEMS.COM> And ENIG has no handling and storage issues like Immersion Silver and Immersion Tin. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis Sent: Thursday, July 28, 2005 8:49 AM To: [log in to unmask] Subject: Re: [TN] RoHs board surface recommendations. If you are talking about PWB metallization, I would recommend ENIG. It is compatible with both Tin/Lead and Lead-free. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos Sent: Thursday, July 28, 2005 8:27 AM To: [log in to unmask] Subject: [TN] RoHs board surface recommendations. Good Day TecNetters. Does anybody out there have Board surface recommendations for a RoHs process ? A matrix would be preferred. I don't seem to recall seeing any such type of document or discussions on TechNet so any help would be greatly appreciated. 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