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July 2005

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Thu, 28 Jul 2005 09:03:59 -0400
Content-Type:
text/plain
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text/plain (81 lines)
And ENIG has no handling and storage issues like Immersion Silver and
Immersion Tin.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
Sent: Thursday, July 28, 2005 8:49 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.

If you are talking about PWB metallization, I would recommend ENIG. It
is
compatible with both Tin/Lead and Lead-free.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos
Sent: Thursday, July 28, 2005 8:27 AM
To: [log in to unmask]
Subject: [TN] RoHs board surface recommendations.

Good Day TecNetters.

Does anybody out there have Board surface recommendations for a RoHs
process
?

A matrix would be preferred. I don't seem to recall seeing any such type
of
document
or discussions on TechNet so any help would be greatly appreciated.

Barry
Western Electronics.




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