Sn0.7Cu requires higher temp to melt vs SAC (~227 vs 217C) so this may be an
issue for a board with a lot of thermal mass.  The Sn0.7 is more ductile,
less creep resistant, and lower strength compared to SAC.


Best regards,
Leo

Director of Applications Engineering
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

ph     512-383-4593
fx      512-383-1590
[log in to unmask]
www.asat.com


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Baski Devre
Sent: Tuesday, June 21, 2005 2:24 AM
To: [log in to unmask]
Subject: [TN] COMPARE SAC305 AND COPPER/TIN ALLOY


Dear Technetters
We want to produce(manufacture) PCB in compliance with RoHS with the alloy
99.3% tin 0.7% copper. I want to learn that if the PCB produced by means of
our alloy will cause any problem during the customer process using
SAC305(96.5% tin 3% silver 0.5% copper) alloy. In the aspect of the PCB
manufacturer If you compare alloy (99.3% tin 0.7%copper) and alloy SAC305
which one is more suitable and better can you please mention advantage and
disadvantage of these two
We are waiting for your kind assistance and interpretation on this
comparison

Best Regards

Yusuf GOMEC
Product Quality Engineer


BASKI DEVRE SAN. ve TIC. LTD. STI.
Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
Tel:0090 216 3901036(4 Line)/4836560(4 Line)
Fax:0090 216 3544941/4913269
Gsm:0090 533 6579897/7480014
Internet: www.baskidevre.com.tr

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