Sn0.7Cu requires higher temp to melt vs SAC (~227 vs 217C) so this may be an issue for a board with a lot of thermal mass. The Sn0.7 is more ductile, less creep resistant, and lower strength compared to SAC. Best regards, Leo Director of Applications Engineering ASAT, Inc. 3755 Capital of Texas Highway, Suite 100 Austin, Texas 78704 ph 512-383-4593 fx 512-383-1590 [log in to unmask] www.asat.com The information contained in this electronic message is CUSTOMER/SUPPLIER PRIVILEGED AND CONFIDENTIAL INFORMATION intended only for the use of the individual or entity named above. If the reader of this message is not the intended recipient, you are hereby notified that any dissemination, distribution and copying of this communication is strictly prohibited. If you have received this communication in error, please immediately notify the sender by electronic mail. Thank you. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Baski Devre Sent: Tuesday, June 21, 2005 2:24 AM To: [log in to unmask] Subject: [TN] COMPARE SAC305 AND COPPER/TIN ALLOY Dear Technetters We want to produce(manufacture) PCB in compliance with RoHS with the alloy 99.3% tin 0.7% copper. I want to learn that if the PCB produced by means of our alloy will cause any problem during the customer process using SAC305(96.5% tin 3% silver 0.5% copper) alloy. In the aspect of the PCB manufacturer If you compare alloy (99.3% tin 0.7%copper) and alloy SAC305 which one is more suitable and better can you please mention advantage and disadvantage of these two We are waiting for your kind assistance and interpretation on this comparison Best Regards Yusuf GOMEC Product Quality Engineer BASKI DEVRE SAN. ve TIC. LTD. STI. Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey Tel:0090 216 3901036(4 Line)/4836560(4 Line) Fax:0090 216 3544941/4913269 Gsm:0090 533 6579897/7480014 Internet: www.baskidevre.com.tr --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------