Currently we are running a prototype on five boards. Three out of the
five are having problems with the snap off rails, the edge of the board
is routed with three mouse bites keeping the rail attached. When the
rail is removed it takes along with it solder mask and what appears to
be epoxy. (In one instance it lifted a trace off the PCB) My first
thought is that the epoxy or solder mask is under cured, my second is
that there is contamination under the solder mask preventing it from
adhering to the PCB. Has anyone come across a problem like this before?
If so what was the cause. Am I wrong in thinking that the laminate might
be under cured?
Thank you,
Ted Tontis CID
NPI Engineer
Creation Technologies Inc.
2250 West Southbranch Boulevard
Oak Creek, WI 53154
Phone 414-761-0400 x6530
Fax 414-761-0582
[log in to unmask]
www.creationtech.com <http://www.creationtech.com/>
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