Currently we are running a prototype on five boards. Three out of the five are having problems with the snap off rails, the edge of the board is routed with three mouse bites keeping the rail attached. When the rail is removed it takes along with it solder mask and what appears to be epoxy. (In one instance it lifted a trace off the PCB) My first thought is that the epoxy or solder mask is under cured, my second is that there is contamination under the solder mask preventing it from adhering to the PCB. Has anyone come across a problem like this before? If so what was the cause. Am I wrong in thinking that the laminate might be under cured? Thank you, Ted Tontis CID NPI Engineer Creation Technologies Inc. 2250 West Southbranch Boulevard Oak Creek, WI 53154 Phone 414-761-0400 x6530 Fax 414-761-0582 [log in to unmask] www.creationtech.com <http://www.creationtech.com/> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------