I know it is late on Friday, but....  I need some opinions on this
subject!!


        IPC 610 addresses fractured solder on the secondary side of the board
after lead trimming.  It is a defect.  What if you have a capacitor mounted
on the primary side of the PCB and have to bend it over the edge of the
board so in its final position it is on the secondary side of the PCB.  We
are seeing some fractures which are understandable, but they are where the
solder fillet meets the lead.  (the little Hershey Kiss on the lead)  We
did a cross section to see if the fracture was affecting the solder in the
PTH.   It had no affect on it, just as we thought.  If the fillet was not
present, I don't believe we would have fractures.  So that being said,
would any of you out there consider this a rejectable defect?

        Connie M. Korth
        Quality Specialist
        Reptron Mfg. Services, Hibbing
        218.262.6902
        [log in to unmask]

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