Hi Jason
28 inches per/ min is much better, specially if there are any BGAs. They are more massive and take longer to come to temp. The profile that Steve suggests is better because it does not burn off the flux before the joints go through the complete reflow.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen Gregory
Sent: Monday, April 25, 2005 6:07 PM
To: [log in to unmask]
Subject: Re: [TN] Solder reflow
Hi Jason,
I might suggest the same thing that Greg is saying. I have an Omniflo-10,
and my
standard oven setpoints look more like this:
110 120 130 140 150 160 180 190 200 235
110 120 130 140 150 160 180 190 200 235
at a belt speed of 32-in./min. As you see, I tend to favor a
"Ramp-to-spike" type
of profile.
The fact that you say if you put a soldering iron to the joints and they
seem to be
fine after that, kind of tells me that your current oven recipe may be a
bit too quick
and not allowing things to heat thoroughly.
I'd slow the belt speed down to around 30-in./min, maybe even 28-in./min.,
but I'd
do a plot with a profiler just like Greg says, and see for sure what the
solder joints
are really seeing...
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
"Anderson, Greg
(GE To: [log in to unmask]
Infrastructure)" cc:
<Greg.Anderson@GE Subject: Re: [TN] Solder reflow
FANUC.COM>
Sent by: TechNet
<[log in to unmask]>
04/25/2005 04:49
PM
Please respond to
TechNet E-Mail
Forum; Please
respond to
"Anderson, Greg
(GE
Infrastructure)"
Jason,
I believe that the Omniflo 7 has around 98-100" total heated length. At
35" per minute conveyor speed, you are cannot be much longer than 2.8
minutes in the heated zones. Depending on how effective your cooling zones
are working, you may have a relatively short and "cool" profile. Even if
your joints are getting to 203 deg C, I wonder if they are above liquidous
long enough the actually "meld" the joints.
You say the recipe and computer screen show the peak temperature is "240".
It sounds like you are reading the SETPOINT of he oven, rather than what
the solder joints achieve.
Have you run a reflow profile with themocouples on/in the joints in
question to determine their actual temperature?
Greg Anderson
Senior Advanced Manufacturing Engineer
GE Fanuc Automation
P.O. Box 8106
2500 Austin Drive
Charlottesville, VA 22911
434-978-5181
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Jason Larson
Sent: Monday, April 25, 2005 5:33 PM
To: [log in to unmask]
Subject: Re: [TN] Solder reflow
Steve, thanks for posting the pictures,
According to the recipe and computer screen at the reflow, the peak
temperature is 240, the machine in use is a Electrovert Omniflo 7E
Profile is as follows
130 150 160 165 165 210 240 Rate is 35"/min
As far as contamination, the poor solder is not limited to one
particular component, also if I use a hand iron "correctly" then the
component does not pull off the pcb.
Thanks,
Jason
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: April 25, 2005 1:34 PM
To: TechNet E-Mail Forum; Jason Larson
Cc: [log in to unmask]
Subject: Re: [TN] Solder reflow
Hi Jason!
I got the pictures you sent to me posted up on my web page for everyone
to take a look at. Go to: http://www.stevezeva.homestead.com
and look at "Swiss Cheese Solder, and Swiss Cheese Solder 2".
What it looks like to me is that either the component had contamination
on the leads and didn't allow the solder to wet, or that the solder
wasn't liquidous long enough to form the metallurgical bond, or allow
all the voids to work themselves out of the joint...I see a lot of voids
in the solder.
Do you know what your peak temperature was during reflow, and how long
did it stay above liquidous?
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | Jason |
| | <jlarson@PACIFICI|
| | NSIGHT.COM> |
| | Sent by: TechNet |
| | <[log in to unmask]>|
| | |
| | |
| | 04/25/2005 02:38 |
| | PM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to Jason |
| | |
|---------+---------------------------->
>-----------------------------------------------------------------------
---------------------------------------|
|
|
| To: [log in to unmask]
|
| cc:
|
| Subject: [TN] Solder reflow
|
>-----------------------------------------------------------------------
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Good day,
investigation into solder reflow performance reveals components that
pull out of the solder fillet with no damage to the component and the
fillet is left intact as well. Solder that was under the component looks
like swiss cheese with multiple holes. What part of the reflow is the
likely cause, conveyor speed, pre-heat, reflow heat, or cool down?
Thanks in advance for any help
Jason
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