Hi Jason 28 inches per/ min is much better, specially if there are any BGAs. They are more massive and take longer to come to temp. The profile that Steve suggests is better because it does not burn off the flux before the joints go through the complete reflow. Regards, Ramon -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen Gregory Sent: Monday, April 25, 2005 6:07 PM To: [log in to unmask] Subject: Re: [TN] Solder reflow Hi Jason, I might suggest the same thing that Greg is saying. I have an Omniflo-10, and my standard oven setpoints look more like this: 110 120 130 140 150 160 180 190 200 235 110 120 130 140 150 160 180 190 200 235 at a belt speed of 32-in./min. As you see, I tend to favor a "Ramp-to-spike" type of profile. The fact that you say if you put a soldering iron to the joints and they seem to be fine after that, kind of tells me that your current oven recipe may be a bit too quick and not allowing things to heat thoroughly. I'd slow the belt speed down to around 30-in./min, maybe even 28-in./min., but I'd do a plot with a profiler just like Greg says, and see for sure what the solder joints are really seeing... Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX "Anderson, Greg (GE To: [log in to unmask] Infrastructure)" cc: <Greg.Anderson@GE Subject: Re: [TN] Solder reflow FANUC.COM> Sent by: TechNet <[log in to unmask]> 04/25/2005 04:49 PM Please respond to TechNet E-Mail Forum; Please respond to "Anderson, Greg (GE Infrastructure)" Jason, I believe that the Omniflo 7 has around 98-100" total heated length. At 35" per minute conveyor speed, you are cannot be much longer than 2.8 minutes in the heated zones. Depending on how effective your cooling zones are working, you may have a relatively short and "cool" profile. Even if your joints are getting to 203 deg C, I wonder if they are above liquidous long enough the actually "meld" the joints. You say the recipe and computer screen show the peak temperature is "240". It sounds like you are reading the SETPOINT of he oven, rather than what the solder joints achieve. Have you run a reflow profile with themocouples on/in the joints in question to determine their actual temperature? Greg Anderson Senior Advanced Manufacturing Engineer GE Fanuc Automation P.O. Box 8106 2500 Austin Drive Charlottesville, VA 22911 434-978-5181 -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Jason Larson Sent: Monday, April 25, 2005 5:33 PM To: [log in to unmask] Subject: Re: [TN] Solder reflow Steve, thanks for posting the pictures, According to the recipe and computer screen at the reflow, the peak temperature is 240, the machine in use is a Electrovert Omniflo 7E Profile is as follows 130 150 160 165 165 210 240 Rate is 35"/min As far as contamination, the poor solder is not limited to one particular component, also if I use a hand iron "correctly" then the component does not pull off the pcb. Thanks, Jason -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: April 25, 2005 1:34 PM To: TechNet E-Mail Forum; Jason Larson Cc: [log in to unmask] Subject: Re: [TN] Solder reflow Hi Jason! I got the pictures you sent to me posted up on my web page for everyone to take a look at. Go to: http://www.stevezeva.homestead.com and look at "Swiss Cheese Solder, and Swiss Cheese Solder 2". What it looks like to me is that either the component had contamination on the leads and didn't allow the solder to wet, or that the solder wasn't liquidous long enough to form the metallurgical bond, or allow all the voids to work themselves out of the joint...I see a lot of voids in the solder. Do you know what your peak temperature was during reflow, and how long did it stay above liquidous? Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+----------------------------> | | Jason | | | <jlarson@PACIFICI| | | NSIGHT.COM> | | | Sent by: TechNet | | | <[log in to unmask]>| | | | | | | | | 04/25/2005 02:38 | | | PM | | | Please respond to| | | TechNet E-Mail | | | Forum; Please | | | respond to Jason | | | | |---------+----------------------------> >----------------------------------------------------------------------- ---------------------------------------| | | | To: [log in to unmask] | | cc: | | Subject: [TN] Solder reflow | >----------------------------------------------------------------------- ---------------------------------------| Good day, investigation into solder reflow performance reveals components that pull out of the solder fillet with no damage to the component and the fillet is left intact as well. Solder that was under the component looks like swiss cheese with multiple holes. What part of the reflow is the likely cause, conveyor speed, pre-heat, reflow heat, or cool down? Thanks in advance for any help Jason --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. 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In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------