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| From: | |
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| Date: | Mon, 25 Apr 2005 15:34:11 -0500 |
| Content-Type: | text/plain |
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Hi Jason!
I got the pictures you sent to me posted up on my web page for
everyone to take a look at. Go to: http://www.stevezeva.homestead.com
and look at "Swiss Cheese Solder, and Swiss Cheese Solder 2".
What it looks like to me is that either the component had contamination on
the leads and didn't allow the solder to wet, or that the solder wasn't
liquidous
long enough to form the metallurgical bond, or allow all the voids to work
themselves
out of the joint...I see a lot of voids in the solder.
Do you know what your peak temperature was during reflow, and how long did
it stay
above liquidous?
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+---------------------------->
| | Jason |
| | <jlarson@PACIFICI|
| | NSIGHT.COM> |
| | Sent by: TechNet |
| | <[log in to unmask]>|
| | |
| | |
| | 04/25/2005 02:38 |
| | PM |
| | Please respond to|
| | TechNet E-Mail |
| | Forum; Please |
| | respond to Jason |
| | |
|---------+---------------------------->
>--------------------------------------------------------------------------------------------------------------|
| |
| To: [log in to unmask] |
| cc: |
| Subject: [TN] Solder reflow |
>--------------------------------------------------------------------------------------------------------------|
Good day,
investigation into solder reflow performance reveals components that pull
out of the solder fillet with no damage to the component and the fillet is
left intact as well. Solder that was under the component looks like swiss
cheese with multiple holes.
What part of the reflow is the likely cause, conveyor speed, pre-heat,
reflow heat, or cool down?
Thanks in advance for any help
Jason
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