Hi Jason! I got the pictures you sent to me posted up on my web page for everyone to take a look at. Go to: http://www.stevezeva.homestead.com and look at "Swiss Cheese Solder, and Swiss Cheese Solder 2". What it looks like to me is that either the component had contamination on the leads and didn't allow the solder to wet, or that the solder wasn't liquidous long enough to form the metallurgical bond, or allow all the voids to work themselves out of the joint...I see a lot of voids in the solder. Do you know what your peak temperature was during reflow, and how long did it stay above liquidous? Kind regards, -Steve Gregory- Senior Process Engineer LaBarge Incorporated Tulsa, Oklahoma (918) 459-2285 (918) 459-2350 FAX |---------+----------------------------> | | Jason | | | <jlarson@PACIFICI| | | NSIGHT.COM> | | | Sent by: TechNet | | | <[log in to unmask]>| | | | | | | | | 04/25/2005 02:38 | | | PM | | | Please respond to| | | TechNet E-Mail | | | Forum; Please | | | respond to Jason | | | | |---------+----------------------------> >--------------------------------------------------------------------------------------------------------------| | | | To: [log in to unmask] | | cc: | | Subject: [TN] Solder reflow | >--------------------------------------------------------------------------------------------------------------| Good day, investigation into solder reflow performance reveals components that pull out of the solder fillet with no damage to the component and the fillet is left intact as well. Solder that was under the component looks like swiss cheese with multiple holes. What part of the reflow is the likely cause, conveyor speed, pre-heat, reflow heat, or cool down? Thanks in advance for any help Jason --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- __________________________________________________________________ This message may contain information that is privileged and confidential to LaBarge, Inc. It is for use only by the individual or entity named above. If you are not the intended recipient, you may not copy, use or deliver this message to anyone. In such event, you should destroy the message and kindly notify the sender by reply e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------