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April 2005

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TechNet E-Mail Forum <[log in to unmask]>, "Stephen M. Vargas" <[log in to unmask]>
Date:
Fri, 1 Apr 2005 10:08:37 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
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Jeffrey Bush <[log in to unmask]>
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If the design is SMOBC this process is in violation.  We have seen
specific references to not put tin of silver under the soldermask.   

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 
-----Original Message-----
From: Stephen M. Vargas [mailto:[log in to unmask]] 
Sent: Friday, April 01, 2005 8:42 AM
To: [log in to unmask]
Subject: [TN] Immersion Silver

Good Day All:

    A question arose at our factory regarding immersion silver surface
finish. We recieved boards where the solder masking was applied after
the
immersion silver was applied to the PWB. Are there potential solder mask
adhesion issues with this? Should the solder mask be applied prior to
adding the surface finish? Any insight would be appreciated. Thanks.

Regards,
Steve Vargas

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