The initial question relates to the Thermal Shock criteria found in
MIL-PRF-55110 - this is a bare board test and has nothing to do with solder joints.
When this document initially covered teflon products it was decided that the
temp extremes should be changed for this type of product and only continuity
would be the final pass/fail criteria.  That is when the additional temperature
range was added.

Susan Mansilla
Robisan Lab

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