The initial question relates to the Thermal Shock criteria found in MIL-PRF-55110 - this is a bare board test and has nothing to do with solder joints. When this document initially covered teflon products it was decided that the temp extremes should be changed for this type of product and only continuity would be the final pass/fail criteria. That is when the additional temperature range was added. Susan Mansilla Robisan Lab --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------