> Hello T'Netters,
> Recently, the issue of the use of rigid printed wiring boards in an
> application
> which demands that printed wiring boards be pressed into an outer shell
> with some
> degree of curvature has surfaced.
> I'm accustomed to the use of flexible substrates for applications which
> demand
> any form of application in which the board does not stay flat.
> However, I don't see any IPC document which mandates the use of rigid
> boards
> for 180-degree assembly applications and flex boards (or rigid-flex) for
> anything else.
> Are there any guidelines for the selection of one type over another?
> Are there any reliability issues with the use of surface mount devices on
> flex boards which don't also apply to rigid boards?
> Why would a manufacturer opt for a rigid board over a flex board for
> assemblies which
> are subsequently flexed?  Is this a choice based on cost?
>

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