Hi Dan, Ken, , , IPC-LF Listservers,

Hey Thanks. I have had the document and will read it again. When you wrote
August I said to self "Hey self   I knew that date".

Yes you kept it SIMPLE

I don't want to discuss "On the Market" since I am sure this term is still
with us as a point of contention. Even that Dolby / DTI meeting.

Now I understand for full components like the phone, or the headset of a
Bose Audio Box yet how about

1>Sub-assemblies
2>Components (small packages like BGA, transistors, caps)?
3>Printed Wiring Board Assemblies
4>Printed Circuits

5>Repaired or Refurbished components, sub-assemblies, units ?

6>Exempted Products for the first round (July 2006)

Again Thanks.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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