Thanks, Werner for all these answers,
We could have an alternative by leveraging the Telecom exemption about lead
in solder. But it seems that we will face :
* discontinuance of SnPb-tinned components, and particularly BGA
* difficulties to be among the exempted, like military, spatial, medical
(mainly cost issue)
* Supply & Demand scenario, i.e. supplier policy with concerns upon
maintaining 2 references for the same component in fit, form, function,
leading to decreasing of the non-compliant vs compliant market
* customer pressure, where it is better to say that we are on the way to
fully compliance, trying to destroy any showstopper
Do we really depend on reliability ? Sure since we need long life (15 years)
components and boards, less sure because application cycle looks "low
stressing" (maybe 2 cycles per day, Tmin=20°C, Tmax=-70°C, ramp up or down
about 0.5°C/min.
Don't you think we can proceed by comparaison to SnPb accelerated test life
but with low stress (-20°C - 120°C as proposed by Gûnther, or 0°C - 100°C ),
considering that SAC is more reliable than SnPb for these low stess
conditions ?
Merci,
Pascal Guihéneuf
Nortel Wireless
UMTS NPI/LCM
GSM/UMTS Environmentally-Friendly Core Team Leader
ESN 574-5382 or 33.1.69.55.53.82 (phone)
ESN 754-2704 or 33.6.64.04.27.04 (mobile)
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]
Sent: lundi 10 janvier 2005 21:47
To: [log in to unmask]
Subject: Re: [LF] Lead-Free Acceleration Factor
Hi Pascal,
At this point I would not put LF-solders into anything other than consumer
products. If you have to depend on reliability, and worse, have severe use
conditions there are no guarantees. I would suggest building an A300 with
LF-solders in the electronics, and fly all the responsible [should be
irresponsible] Brussel bureaucrats on it exclusively.
Werner
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