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January 2005

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Subject:
From:
Kay Nimmo <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 7 Jan 2005 08:37:52 -0000
Content-Type:
text/plain
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text/plain (91 lines)
Dear Ken
Any material that is in the final electronic product is covered by RoHS
including e.g. casings.
Kay

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Ken Patel
Sent: 06 January 2005 18:05
To: [log in to unmask]
Subject: [LF] IPC-1066 question: Lead content in steel and Aluminum


Experts,

I have a questions based on IPC-1066. This document says that ...



This standard shall not apply to:

* Lead as an alloying element in steel containing up to 0.35% lead by
weight, aluminum containing up to 0.4% lead by weight and as a copper
alloy
containing up to 4% lead by weight.

* Lead in electronic ceramic parts (e.g., piezoelectronic devices).



Questions:

Only electronics components are affected and not sheet metal parts used
in
building modules such as base plate which is made of steel. Am I correct
as
we do use base plate made of steel at module level? Or do we need ask
for
RoHS compliance steel and aluminum.



Re,

Ken Patel




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