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Subject:	Re: Marking/Labeling requirement for LF products
From:	MA/NY DDave <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Wed, 5 Jan 2005 23:48:15 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

Hi Again Ken, TI-Doug, Kay, , , IPC LF Listservers,

Doug Thanks for the Resend www link, since the first link gave problems.

I see that at TI and perhaps throughout many JEDEC companies that package
only labelling seems to be the mindset.

At an electronic assembly level in this new mixed world with reliability,
warranty and repair still being a concern, package only labelling isn't as
good as device labelling and will get everyone into future difficulties.

For throw away product it is AOK and YES package only labelling is cheaper.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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