One problem is understanding the difference between "simulation" and
"stimulation".

David A. Douthit
Manager
LoCan LLC

MA/NY DDave wrote:

>Hi JP, (Jean-Paul), Werner, GG, IPC LF Listservers,
>
>I have been reading this recent tread with great interest...
>And I still have to think about and re read what you sent us about SnCu,
>SAC SnPb before the HAPPY New Year To ONE and ALL!!!
>
>Here is one question based on your recent note
>
><1) For thermal cycling of SAC assemblies, I presently use stress/strain
>(hysteresis loop) simulations to optimize test conditions (the goal being
>to accumulate damage in an effective manner).  Optimum profile is actually
>component dependent but there are general trends.>
>
>Now simulations are OK, and in fact great, yet quite often other factors
>have to be put into the models to account for real data. So, simulations to
>me have to go hand and hand with these short accelerated thermal cycling
>stress tests to supply an approximation of life. The greatest joy is when
>the modelling predicts within reason the results of short term thermal
>cycling.
>
>Yours in Engineering, Dave
>YiEngr, MA/NY DDave
>
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