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January 2005

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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 5 Jan 2005 16:22:31 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (293 lines)
All,
Can we have two separate labeling one at PCB level (to be etched by fab
house) and other at PCBA level (assy guy to put label) for leadfree? Is
label acceptable or etching/screen printing is a must? Do we still have to
repeat say HF (Halogen free) related to PCB when we marked the PCBAs label?

Also, looks like IPC-1066 says that circle/ellipse category (such as e1/e2)
but the example shown on page 3 has neither circle nor ellipse. Can we use
the box as shown?

Re,
Ken Patel

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Romm, Doug
Sent: Wednesday, January 05, 2005 2:38 PM
To: [log in to unmask]
Subject: [LF] RESEND: [LF] Marking/Labeling requirement for LF products

Resend with correct web link.


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Romm, Doug
Sent: Wednesday, January 05, 2005 4:36 PM
To: [log in to unmask]
Subject: Re: [LF] Marking/Labeling requirement for LF products

Ken, others,

Here is an example of what TI is doing for our IC components:

http://focus.ti.com/quality/docs/gencontent.tsp?templateId=5909&navigati
onId=11753&path=templatedata/cm/ecoinfo/data/leadfree_logo


We are putting the Pb-free logo and component finish on the packing
label following JESD97 Joint Electronic Device Engineering Council
(JEDEC) standard titled "Marking, Symbols and Labels for Identification
of Lead (Pb) Free Assemblies, Components and Devices."



Best regards,

Doug Romm
Texas Instruments



-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Ken Patel
Sent: Wednesday, January 05, 2005 4:23 PM
To: [log in to unmask]
Subject: Re: [LF] Marking/Labeling requirement for LF products

Kay,
Can we apply leadfree identification label on the outside packing box
and
not on the assembled board?

Re,
Ken Patel

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Kay Nimmo
Sent: Wednesday, January 05, 2005 1:16 AM
To: [log in to unmask]
Subject: Re: [LF] Marking/Labeling requirement for LF products

There are also some JEITA guidelines for marking components and
assemblies.

They may have it on their site otherwise it is on our site;
www.lead-free.org
Under - Information/supply chain issues/marking .....

Dont forget the only legal requirement for marking relates to the WEEE
directive (date of manufacture or similar) rather than RoHS.

Kay


+++++ Visit our lead-free.org website +++++
Soldertec at Tin Technology Ltd, Unit 3, Curo Park
Frogmore, St Albans, AL2 2DD, UK
Direct dial: +44 (0)1727 871 312
Switchboard: +44 (0)1727 875 544
Fax: +44 (0)1727 871 341
[log in to unmask], http://www.lead-free.org

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Romm, Doug
Sent: 05 January 2005 04:06
To: [log in to unmask]
Subject: Re: [LF] Marking/Labeling requirement for LF products


Ken,

The only industry standard I am aware of is JEDEC JESD97 which was
released earlier this year.

I'm sure it's available on the JEDEC website.



Regards,

Doug Romm
Texas Instruments



-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Ken Patel
Sent: Tuesday, January 04, 2005 7:27 PM
To: [log in to unmask]
Subject: [LF] Marking/Labeling requirement for LF products

LF pals,

I have few questions regarding LF product marking.

(1) Is there a marking/labeling requirement for LF products?

(2) Will it be required on each LF assemblies or outside on a system
(with
many cards inside)?



Re,

Ken Patel


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Our offices will be closed from 17.00 on Friday 24th December re-opening
normal time on Tuesday 4th January 2005

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