Hi JP, (Jean-Paul), Werner, GG, IPC LF Listservers,

I have been reading this recent tread with great interest...
And I still have to think about and re read what you sent us about SnCu,
SAC SnPb before the HAPPY New Year To ONE and ALL!!!

Here is one question based on your recent note

<1) For thermal cycling of SAC assemblies, I presently use stress/strain
(hysteresis loop) simulations to optimize test conditions (the goal being
to accumulate damage in an effective manner).  Optimum profile is actually
component dependent but there are general trends.>

Now simulations are OK, and in fact great, yet quite often other factors
have to be put into the models to account for real data. So, simulations to
me have to go hand and hand with these short accelerated thermal cycling
stress tests to supply an approximation of life. The greatest joy is when
the modelling predicts within reason the results of short term thermal
cycling.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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