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November 2004

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Subject:
From:
John Guy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Guy <[log in to unmask]>
Date:
Thu, 4 Nov 2004 15:42:30 -0500
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text/plain
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text/plain (46 lines)
Yannick,
        If the holes are spaced in a regular pattern, you can break up the pad into a "Windowpane" pattern with the bars of the Windowpane covering the holes.  This should keep the solder on the top side and still give you a good joint.  If the holes are in an odd pattern, this solution may not work for you.

Hope this helps,

John G.

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of Yannick Brisson
Sent:   Thursday, November 04, 2004 3:05 PM
To:     [log in to unmask]
Subject:        [TN] D-Pack, holes, solder

Hi everyones,

        I would like to have your input and idea on it.  we have a board
with 1 D-Pack SMT on it. For the heat sink there are some hole on the board
under the component body.  So after the oven the paste have sunk on the
other side of the board.  We don't want any solder on the other side .  We
didn't desing the board so we couldn't change it.  Do you know some trick to
block the paste from going on the back side of the board?

Thank You

Yannick

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