Hi Bill,
The immediate fix is to make the pads larger. The real problem is a larger
CTE mismatch between the SOD323 and the PCB, and thoise leads do not even
deserve to be called leads--zero compliancy. These 'leads' need to be turned UNDER
the component body to decrease the DNP.
BUT, neither of these steps assures a solution--it may simply move the
failure mode from ripped-out pads to fractured solder attachments.
The real solution is to turn the component upside-down and provide it with
longer compliant leads; no sacrifice in real estate..

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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