Hi Joe,

It could be that I don't understand the IPC well enough due to the fact
English is not my native language, but for me the IPC-A-610 says
"entrapped balls that are smaller than 0.13 mm are process indicators"
and "solder balls that are not entrapped or encapsulated (no matter
their size) are defects" .
This corresponds well with the ANSI-J-STD001C that mentions "Solder
balls or other metal particles shall neither be loose (i.e., be
dislodged in the normal service environment of the product) nor violate
minimum electrical clearance." Again I would make the interpretation as
"loose solder balls, no matter how small, are defects".





Best regards,

Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems

Tel        +31(0)35 524 8297
Fax       +31(0)35 524 8181
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>>> [log in to unmask] 10/08/04 05:55pm >>>
Hi Group,
Solder balls that are smaller than 0.13 mm (0.005 inch) and less than 5
per
600 mm squared (0.93 sq inch) are process indicators.  If greater than
0.13
mm and not entrapped then it would be a defect.  By entrap it usually
means
solder balls are trapped in no clean flux or in adhesives of some sort
or
tacked on to a conductor but not creating a clearance violation.

  Joe Bruce
  Functional Excellence
  Solectron - Winnipeg
  204 631-7233

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-----Original Message-----
From: Tom Moore [mailto:[log in to unmask]]
Sent: Friday, October 08, 2004 9:36 AM
To: [log in to unmask]
Subject: [TN] Solder balls acceptance criteria


Dear Group,
I'm asking the group again to impart your communal wisdom in
interpreting
IPC-A-610. We are seeing solder balls on our SMT assemblies after they
have
gone thru board wash (dishwasher). Would these be classified as
entrapped/encapsulated and therefore process indicators and not
subject
to "rework" (as long as they don't violate minimum electrical
clearance)?
Thanks.

Tom Moore

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