Hey Scott,

The Silicon Valley Chapter has the same topic for our November 9th
meeting to be held at Mentor Graphics. Here is the bio on the speaker
who happens to be a member of the San Diego Chapter. Perhaps you
might want to contact him - if he is not already your speaker :-)


Topic: Via In Pad - A New Approach"

Items covered

1-       Reasons for implementing Pad on via

2-       The new approach to successfully implement this at the fabrication

3-       The old side effects and new process such as blow hole, via cracking etc

4-       Are the any issues during assembly, or design considerations?



About the Speaker:

Donald A. Carron

Director of Technology

TTM Technologies, Inc.

Santa Ana Division

Entered the world of PWB manufacturing in January 1983, and had the opportunity to work in all aspects of production from front-end planning through final inspection. Became a Director of Quality Assurance in the mid eighties, and developed an outline for quality engineering functions in both mechanical and wet processing areas of manufacturing. Worked in process development in the mid nineties through the present, with an emphasis on emerging technologies to facilitate high-density routing in modern printed circuit design. Worked with the first company (in Japan) to develop fully copper-plated microvia geometries, which was the forerunner to current plating technologies utilized in advanced facilities today (such as TTM Santa Ana, who employs the most advanced microvia plating process currently available). I am currently Director of Technology at TTM Technologies' Santa Ana Division, and am responsible for both product development and process engineering staff.

University of Vermont-Mathematics

National University-Business

ASQ CQE Training

Member of IPC Designer's Council-San Diego Chapter





Scott McCurdy <[log in to unmask]> wrote:
The Orange County, CA chapter of the IPC Designers Council is planning our
November 16th meeting and our topic will be Via-in-Pad designs. We've got a
top notch board shop lined up to be on our panel, but I'm searching for
someone to present a designer's perspective of their experiences with
Via-in-Pad designs.

Can anyone out there direct me to someone who'd be both qualified and
interested in presenting their experiences with Via-in-Pad designs at our
next meeting here in southern California...?


Best regards,

Scott McCurdy

IPC Designers Council - Orange County Chapter president

www.ipcdesignerscouncil.org



Western Regional Mgr.
diversifiedsystems, inc.


cell (714) 425-3235

office (714) 970-9780

eFax (714) 242-1952
eMail [log in to unmask]

website www.divsys.com


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