Thank's!
-----Original Message-----
From: Joe O'Neil [mailto:[log in to unmask]]
Sent: Tuesday, October 05, 2004 12:41 PM
To: [log in to unmask]
Subject: Re: [DC] Lead-Free Fab_notes
Fred and Ray;
Just last week we held a Lead Free Seminar in conjunction with the IPC
and CCA. Copies of the presentation can be downloaded from:
http://www.hunterpcb.com/?action=text&id=100
In addition to Fred's point about the solder finishes there are also
concerns about the laminates - the reflow temperatures are higher within
the majority of lead-free processes. There are also the issues of how
your board finish will interact with any of the dozen's of lead-free
solders. And then how will those interact with your components which
may or may not be lead-free.
I really appreciate the question, because I see the problem as being one
of convergence. From most fabricators you get the answer that Ray got,
'no problem,' from most assemblers you get the same answer. It is only
when the poor OEM and the Designer sit down to put the project together
that it becomes clear that it is a big issue and can be a very big
problem.
Also on the site are downloads of the IPC's Solder Products Value
Council study on lead-free SAC Alloys. And a presentation from a
Component Distributor who warns that 20-25% of the component
manufacturers are not changing part numbers when the change their
components to lead-free - So even if you are on a Military Project with
no lead-free concerns, you might see one of your components change
without a revision change- very nice indeed.
For designers, I see this as a major opportunity to increase the
value-add you bring to a project, to coordinate and call out the
COMPLETE OEM requirements, not simply the laminate and finish, put also
the paste.
Everyone seems to be looking for an opportunity of the US to regain some
footing in the design area, this lead-free implementation problem
requires someone to step forward and deliver to customers a clear and
complete solution, why can't it be the designer. Why shouldn't it be
the designer?
Hopefully you find the presentation materials helpful.
My $0.02,
Joe O'Neil
Joseph F. O'Neil Vice President & General Manager
Hunter Technology Corporation Subsidiary of Ambitech International
2941 Corvin Drive Santa Clara, California 95051
(408) 245-5400 [log in to unmask]
Fax (408) 245-5503 www.hunterpcb.com
-----Original Message-----
From: Ray Johnston [mailto:[log in to unmask]]
Sent: Tuesday, October 05, 2004 8:55 AM
To: [log in to unmask]
Subject: Re: [DC] Lead-Free Fab_notes
Fred,
I talked to one of our board houses (Prototron Circuits) and they where
saying that lead free won't really affect the board designer, it
primarily
affects manufacturing. Manufacturing may request a different finish for
the
pads to get a better solder joint and at that time we can talk to our
board
houses regarding other finishes and select a different finish.
Sounds like when we go to lead free it will be a time of trial and
error, if
anything changes at all.
Ray Johnston
Lead CAD Designer
Rane Corporation
425-355-6000
rayj@rane,com
----- Original Message -----
From: "Fred Dark" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, October 04, 2004 10:00 AM
Subject: [DC] Lead-Free Fab_notes
> Dear Designer Council, I'm looking to get some information on
"Lead-Free"
> technology... from a PCB designers point of view, what would I have to
do
> different for design and documentation... how would my fabrication
notes
> change for this technology... For a standard Fr-4 material, would this
> have to be different... along with finishes and etc... I know there is
a
> lot of manufacturing issues with solder paste, solder temp. and more,
but
> from a designers point of view, what will I have to do different...
I'm
> reading up on the technology, but I'm not seeing what to do as far as
from
> a designers point of view... Can someone point me in the right
direction
> for notes, books from a designers point of view... and what ever other
> info that I would need to know...
>
> Thank's as always, Fred Dark Jr.
>
>
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