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September 2004

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Subject:
From:
Susan Mansilla <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 15 Sep 2004 09:02:50 EDT
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Hi Steve
We spend a lot of time on failure analysis of these little cups full of acid
and the resulting etching out of hole wall copper.

IPC has a committee now almost ready for a round robin of the various types
of tenting/capping/plugging etc methods.  It is D33-d Via Protection.  You can
go to the IPC website and look at the draft of the document we are working on
at this time.

If you go to 2221A para 4.5.1 it tells you the vias have to be tented on both
sides.

Susan Mansilla
Robisan Lab

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