We build many PCB assemblies in panels that are either tabbed or scored.
We have a "pizza cutter" depanelizer, though the line operators find it
easier to just snap the boards apart in some cases.  A month or so ago, we
(manufacturing engineers) mandated using the pizza cutter for depanelizing
all scored boards, because of the possibility of cracking boards or
components while snapping the boards.  Apparently a few operators
complained to their manufacturing supervisor that this takes longer, so he
decided that they don't have to use the pizza cutter unless we can show why
this is necessary.

I searched the IPC documents, but did not find any information on board
depanelizing.  I searched the TechNet archives and found some threads on
the topic, indicating that snapping scored boards can cause damage, and
some recommended minimum spacing for components from the score lines to
minimize the risk of damage.

Are there any specifications or test reports that may give more information
that we could use to mandate the use of the depanelizer on scored boards?

Dave Roach
Manufacturing Engineer
Trane Global Controls and Contracting
St. Paul, Minnesota

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