We build many PCB assemblies in panels that are either tabbed or scored. We have a "pizza cutter" depanelizer, though the line operators find it easier to just snap the boards apart in some cases. A month or so ago, we (manufacturing engineers) mandated using the pizza cutter for depanelizing all scored boards, because of the possibility of cracking boards or components while snapping the boards. Apparently a few operators complained to their manufacturing supervisor that this takes longer, so he decided that they don't have to use the pizza cutter unless we can show why this is necessary. I searched the IPC documents, but did not find any information on board depanelizing. I searched the TechNet archives and found some threads on the topic, indicating that snapping scored boards can cause damage, and some recommended minimum spacing for components from the score lines to minimize the risk of damage. Are there any specifications or test reports that may give more information that we could use to mandate the use of the depanelizer on scored boards? Dave Roach Manufacturing Engineer Trane Global Controls and Contracting St. Paul, Minnesota --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------