Its should be in the LF Forum but,
Anyone has made any qualification tests to this combination of SAC
(Sn/Ag/Copper) bumps with Sn/Pb solder paste:
HALT - HASS or metalographic / microscopic test of the combination of the
two alloys and what are the new parameters received?
and where I can see such reports and what is the bottom line?





Best  Regards

Reuven  ROKAH




                      Vladimir Igoshev
                      <[log in to unmask]         To:      [log in to unmask]
                      M>                       cc:
                      Sent by: TechNet         Subject: Re: [TN] Reflowing leadfree CSP
                      <[log in to unmask]
                      >


                      20/07/2004 23:23
                      Please respond
                      to "TechNet
                      E-Mail Forum.";
                      Please respond
                      to Vladimir
                      Igoshev





Pb-free balls will always "collapse" once in contact with a Pb-Sn alloy.

Vladimir

Vladimir Igoshev,
Research in Motion
451 Phillip St.
Waterloo, ON, N2L 3X2

Voice: (+1) 519-888-7465, ext. 5283
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-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Tuesday, July 20, 2004 3:36 PM
To: [log in to unmask]
Subject: Re: [TN] Reflowing leadfree CSP


We tried this and were not able to treat the ball as though it were "high
temp". The Pb-Free balls collapsed, even with reflow temperature at around
210, and looked like a jiffy-pop popcorn bag. We did not attempt to qual
the
results.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter L
> Sent: Tuesday, July 20, 2004 3:03 PM
> To: [log in to unmask]
> Subject: [TN] Reflowing leadfree CSP
>
> Technet,
>
> Is there any process/ reliability concern with reflowing a
> 0.5mm pitch CSP with lead free solder bumps using a tin/lead
> solder paste process? Assuming that the reflow profile will
> not cause any melting/collapsing of the lead free solder bumps.
>
>
> Rgds,
> Peter

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