Hello,

we have following problem:
We are using ceramic chips on FR4 due to the temperature cycles we use
during burn in (-40 to +85°C) the chips are sheared of the board. I know
that there is the possibility to solder column interposers onto the chips.
But doing this we would loose the warranty on the chips which we don't
want. We need a soldering solution between chip and board. Is there a
company that offer mezzanie ype of boards with a material that takes the
CTE? A solution converting the BGA to a PGA is not possible due to
vibration in the application.

Any other solution??

Thanks a lot
Timo

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