Hello Ioan,
Engent Inc. (http://www.engentaat.com/) , as part of Siemens Dematic,
has done a lot of work on 0201s and has published a number of papers. They
have great capability in their Norcross, Ga. (just north of Atlanta)
facility. Their web site offers the following papers:
Processing Strategies for High Speed 0201 Implementation
Abstract :: Interest in using 0201 packages has increased greatly recent
years due to the growth of the portable or hand held sectors of the
electronics industry and miniaturization trends in consumer and commercial
products. Other areas that 0201s are gaining influence include the RF
applications and system in a package (SiP). A lot of research has been done
to determine the board design considerations for 0201 processing, but work
also needs to be done to determine the process window.
Initial data presented last year showed a number of significant factors in
the printing, placement, and reflow processes. From that study, the
individual process steps showed that certain design and manufacturing
parameters can have a huge effect upon total process defects.
Presented in this paper is the data from those studies as well as the data
gathered after a large evaluation run in which many components were
processed. Studied process parameters were broken out by individual process
steps initially, and then studied over the entire process. Some of the
process parameters that were examined were stencil manufacturing method,
print force, print speed, and stencil wipe frequency for the printing
process and reflow atmosphere, profile shape, and ramp rate for the reflow
process. From these studies, a reliable process window was obtained for a
high speed 0201 assembly process that was proven to provide a 17 DPM
assembly yield.
Request This Paper
Designing an 0201 Assembly Process for High Yield and Reliability
Abstract :: The use of 0201 packages is increasing from year to year as the
industry continues to drive towards smaller, lighter, faster products. Many
military applications are demanding miniaturized, high reliability designs
to improve field performance and to reduce size and weight. An array of ten
0201s takes up almost 1/3 the area compared to 0402s. Therefore, components
can be grouped tighter together to reduce board size and decrease weight
while meeting harsh environment reliability requirements. The main
challenges with the introduction of 0201 components in designs are that the
key design factors for manufacturability are relatively unknown in the
design community and confidence in the process window and its stability are
unknown in the manufacturing sector since the process windows for 0201s do
not scale from that of 0402s. This paper focuses on the a comprehensive
analysis of the 0201 process, 0201 assembly reliability, and 0201 design for
manufacturability factors to provide streamline introduction of
miniaturized, high reliability COTS assemblies. Design factors studied
include pad design, pad shape, pad pitch, pad spacing, ground plan effects,
via-in-pad, feed trace width, component proximity, heat sinking effects,
etc. Studied process parameters were broken out by individual process steps
initially, and then studied over the entire process. Some of the process
parameters that were examined were stencil manufacturing method, print
force, print speed, and stencil wipe frequency for the printing process and
reflow atmosphere, profile shape, and ramp rate for the reflow process.
Robust design for manufacturing guidelines were developed and a reliable
process window was obtained for a high speed 0201 assembly process that was
proven to provide less than a 100 DPM assembly yield for both eutectic lead
tin and lead free solder assemblies. Reliability performance of 0201
assemblies has also proven robust exhibiting high reliability in temperature
humidity, air-to-air thermal cycling, and vibration environmental stress
tests.
Request This Paper
Process Capability Case Study on 0201 Processing Utilizing 3D Automated
Optical Inspection
Abstract :: The introduction and use of smaller component packaging in
electronic assemblies is driven by the need to reduce the overall product
size while increasing functionality and performance. One of the more popular
emerging package technologies is the 0201 discrete package. Shrinking
component package sizes present numerous process challenges for electronics
manufacturers and equipment suppliers. An SMT assembly process research
facility in Norcross, Georgia undertook a project to develop a stable and
reliable 0201 assembly process. A major challenge for the R&D facility was
finding an AOI system capable of making the process measurements necessary.
The researchers selected a 3D AOI system capable of both solder paste volume
and component placement accuracy measurements. The system was used
extensively in the 0201 process development study and the researchers relied
upon the measurement data to draw many important conclusions about the
process. The purpose of this paper is to present the performance of the
developed process and the performance of the AOI system based on the results
of the development project.
Request This Paper
Designing a High Yield 0201 Assembly Process for New Product Introduction
Abstract :: The use of 0201 packages is increasing from year to year as the
industry continues on its drive to smaller, lighter, faster. An array of ten
0201s takes up almost 1/3 the space of an array of 0402s. Therefore,
components can be grouped tighter together to reduce board size. The main
problem with the introduction of 0201 components is that the process window
decreases as the size of the component decreases. An 0201 component has been
shown to have ten times the likelihood to tombstone when compared to a 1206
and almost 2 ½ times as likely to tombstone as compared to an 04021. For
this reason, a lot of attention must be paid to the design and processing of
0201 components for surface mount assembly.
In general, it has been found that the static factors (i.e. board and
stencil design) have a much larger effect on the number of defects than the
dynamic factors of the assembly process (i.e. print parameters, placement
parameters, and reflow parameters). Some dynamic factors do have a large
impact upon the assembly process (i.e. air versus nitrogen environment in
the reflow), but overall the static design factors have a much greater
impact upon the number of defects. Over the course of the study, the optimum
assembly parameters were found and the effect of the design parameters on
these assembly parameters will be shown in terms of defect per million
numbers.
Presented in this paper is the data from those studies as well as the data
gathered after large evaluation runs in which many components were
processed. Studied process parameters were broken out by individual process
steps initially, and then studied over the entire process. Some of the
process parameters that were examined were print force, print speed, and
stencil wipe frequency for the printing process and reflow atmosphere,
profile shape, and ramp rate for the reflow process. From these studies, a
reliable process window was obtained for a high speed 0201 assembly process
that was proven to provide a DPM of less than 200.
Request This Paper
------------------------------------
Leo M. Higgins III, Ph.D.
Director of Applications Engineering
[log in to unmask]
3755 Capital of Texas Hwy-So
Suite 100
Austin, TX USA 78726
tel: 512-383-4593
fax: 512-383-1590
mobile: 512-423-2002
------------------------------------
-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]]
Sent: Monday, May 31, 2004 9:49 AM
To: [log in to unmask]
Subject: [TN] Assembly and design of 0201
Hi everybody,
I hope ya'll enjoyed a nice long week-end.
So, we have to assess our capability of assembling these babies. Two
questions:
what are the preffered land patterns
where can I find some off-the-shelf test PCBs, that make sense. I checked
with the dummy parts suppliers and the most appealing land pattern I found
is 9x13, with 11 mils spacing. Not to mention that the finish is HASL...
Thanks,
Ioan
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