Good day Technet:
I will be starting an evaluation shortly to determine the reliability of
soldering RF components (no compliant leads, flat leads coming right out of
the bottom of the package) directly to the PWB.  (In the past we always
soldered ribbon jumper leads from the component leads down to the PWB to
ensure strain relief.)  We intend to subject the test hardware to thermal
excursions typical of the actual hardware environment.  My question is
which, if any, is the worst case with regard to longevity of the solder
joints, thermal shock, with virtually no ramp between temperature extremes,
or thermal cycling, with a ramp of, lets say, a minimum of 5 degrees C per
minute?  Opinions are OK, but if you have technical justification for your
answer, it will be appreciated.

Thanks in advance,

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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