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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 2 Jun 2004 12:15:20 -0700 |
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It seems to me that whether the components have LF or not should not necessarily affect the oven profile when using eutectic solder paste. As long as the solder wets the component and the results is smooth shiny joints, that is what is important. What I am trying to say is that the lead free solder does not have to melt to mix with the eutectic one. Of course this is new territory and a lot has to be learned.
Regards,
Ramon
-----Original Message-----
From: Ken Patel [mailto:[log in to unmask]]
Sent: Wednesday, June 02, 2004 2:29 PM
To: [log in to unmask]
Subject: Re: [TN] Antw: [TN] Impact of Mixed, Lead and
Lead-free,component s on assembly proce sses
Guenter,
You think we don't need higher temperature profile for running mixed
components (lead and lead-free) using eutectic solder at assembly house?
Re,
Ken Patel
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guenter Grossmann
Sent: Wednesday, June 02, 2004 12:03 AM
To: [log in to unmask]
Subject: [TN] Antw: [TN] Impact of Mixed, Lead and Lead-free,components on
assembly proce sses
Ken
(1) No as long as you avoid Bi
(2) No
(3) Higher temperatures are only necessary if you use lead free solder
(4) Component manufacturers are changing their components now to be
used for lead free solder and hopefully will let you know. However, if
you intend to switch to lead free it is wise to start asking your
supplier now about a roadmap.
(5) European companies are starting now (and not too early). Many are
at the stage where they produce first pilot lots with lead free solder.
Best regards
Guenter
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
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