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June 2004

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Jun 2004 07:27:24 -0700
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        Hi Daan:
                   I am not aware of any standards for recycle parts, but wouldn't these parts be  in the same situation as reworked parts? Some times there is a need to move  parts due to misalignment or for trouble shooting. This requires them to go through the reflow process. Just my one cent.
        Regards
        Ramon

-----Original Message-----
From: Daan Terstegge [mailto:[log in to unmask]]
Sent: Friday, June 11, 2004 7:20 AM
To: [log in to unmask]
Subject: [TN] Reusing desoldered components


Hi Technet,

We've recently had delamination problems on boards which are populated
with some very expensive QFP's. To minimize the damage we want to
desolder these parts and use them again. Our customer wants some kind of
evidence that the functionality and long term reliability are not
affected, and they want this evidence (i.e. thermal profiles) to be
related to IPC specifications.

I'm not aware of any standard that specifies if reuse of desoldered
components is allowed, and which limitations apply to the temperature
profiles, but perhaps some of you knows such a standard ?

Best regards,

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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