Hi Technet,

We've recently had delamination problems on boards which are populated
with some very expensive QFP's. To minimize the damage we want to
desolder these parts and use them again. Our customer wants some kind of
evidence that the functionality and long term reliability are not
affected, and they want this evidence (i.e. thermal profiles) to be
related to IPC specifications.

I'm not aware of any standard that specifies if reuse of desoldered
components is allowed, and which limitations apply to the temperature
profiles, but perhaps some of you knows such a standard ?

Best regards,

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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