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Subject:	Lead-free Assy process and fab surface finish
From:	Ken Patel <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 15 Jun 2004 14:06:37 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (32 lines)

Technetters,

I do have few questions related to fab surface finish in lead-free assembly
environment.



(1)Do you see any problem with board surface finishes, particularly OSP,
HASL, and Nickel-Gold?



(2) What should be the minimum Tg of Fab material? Is Tg of >170C is good
enough?



Re,

Ken Patel


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