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June 2004

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Subject:
From:
"Chafin, Ken G." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 4 Jun 2004 13:21:00 -0400
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text/plain (19 lines)
Does IPC plan to amend standards governing acceptance criteria of soldered
connections as a consequence of a transition to the use of lead free solder.
If so, where can one locate specific information on this subject.

(I suspect some version of this question has been asked and answered many
times--just point me in the right direction.)

Thanks

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