Experts,

  I searched a couples of documents about BGA leadfree backward/forward
compatibility and can not find a clear answer about this issue.

   1. Backward compatibility. How about the solder-joint quality after we
changed the oven profile above 230C compared with the conventional tin-lead
solder-joint?

   2. Forward compatibility.  A document from NEMI with datum showed the
voids increased but no explaination.  What's the root cause?


   BGA looks like a big question when transition to lead-free.

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