Hi Charles,

I once faced with the problem on such issue. I solved by using a rubber
squeegee. And I was consistently getting 99.7% yield rate or even higher,
without solder short and unsoldered joint.

I guess many people do not use rubber squeegee nowsaday. Getting a good
print definition is important and getting a good stencil is important so as
to have a good paste release.

And one more important area is the solderpaste. Good paste provides good
print defintion as well as resolving bridging issue.

Sometimes, I use manual printing process on 20 mil pitch components, and so
far there is no issue on bridging and no solder or insufficient solder.

Good Luck.

Poh


At 05:56 PM 2/17/04 -0600, you wrote:
>We have a new assy. that uses 1206 capacitor networks. We are have a serious
>problem with bridging and unsoldered connections. We think we may have solved
>the non soldered problem by increasing the soak before reflow but still have
>the bridging. Anybody have similar experiences? We are using a 5 mil.
>stencil. The other parts all seem to solder well. We are considering having
>the apertures for these parts reduced. Any suggestions would be greatly
>appreciated.
>
>Charles Caswell
>The Big Kahuna
>
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