BK,

What is your board finish, thickness, part layout? Is your part layout
balanced with all pads being the same size. Is the layout what the MFG
recommends? What is the part/pad overlap in mils and percentages? Are your
solder pads soldermask defined 100%. Is your process clean or no-clean. Who
is the paste MFG? Who is the MFG of the component and is there more than
one? What is the datecode on the parts? Is this defect universal or can be
seen as happening in a certain area or with a particular layout or on a
certain side of the board or connected to significant local ground plane?
How are the boards being inspected after printing but before loading?

Dorothy Lush
Manufacturing Manager
12 telecom International, Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Charles Caswell
Sent: Tuesday, February 17, 2004 3:56 PM
To: [log in to unmask]
Subject: [TN] capacitor networks


We have a new assy. that uses 1206 capacitor networks. We are have a serious
problem with bridging and unsoldered connections. We think we may have
solved
the non soldered problem by increasing the soak before reflow but still have
the bridging. Anybody have similar experiences? We are using a 5 mil.
stencil. The other parts all seem to solder well. We are considering having
the apertures for these parts reduced. Any suggestions would be greatly
appreciated.

Charles Caswell
The Big Kahuna

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