BK, What is your board finish, thickness, part layout? Is your part layout balanced with all pads being the same size. Is the layout what the MFG recommends? What is the part/pad overlap in mils and percentages? Are your solder pads soldermask defined 100%. Is your process clean or no-clean. Who is the paste MFG? Who is the MFG of the component and is there more than one? What is the datecode on the parts? Is this defect universal or can be seen as happening in a certain area or with a particular layout or on a certain side of the board or connected to significant local ground plane? How are the boards being inspected after printing but before loading? Dorothy Lush Manufacturing Manager 12 telecom International, Inc. -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Charles Caswell Sent: Tuesday, February 17, 2004 3:56 PM To: [log in to unmask] Subject: [TN] capacitor networks We have a new assy. that uses 1206 capacitor networks. We are have a serious problem with bridging and unsoldered connections. We think we may have solved the non soldered problem by increasing the soak before reflow but still have the bridging. Anybody have similar experiences? We are using a 5 mil. stencil. The other parts all seem to solder well. We are considering having the apertures for these parts reduced. Any suggestions would be greatly appreciated. Charles Caswell The Big Kahuna --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------