Wow, thats serious flaking/peeling.

Sue, what does the copper underneath these areas look like? The areas where
the mask came off, discoloration, residue, etc?

Do you have any bare boards remaining? Do you know the finished copper
weight of these boards? Was it print and etch by any chance?

It gives the appearance of poor surface treatment prior to mask; however,
I've never seen anything that severe before, even contaminated surfaces will
hold solder mask to a degree, if they happened to apply solder mask over
copper foil perhaps the much smoother surface would prevent adequate
adhesion of the mask...poor cure should also be consider...

All this is assuming you did not soak the boards in diesal fuel for 2 days
before processing them....(that...was a joke people, lighten up)

Franklin

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