(chuckling at all this)

First of all, I did ask questions in my initial response, they are pasted
below

((Where are you seeing this at? over ground planes? on traces? glass? are
you
seeing it before processing? (bare boards) are they using LPI or UV mask?
what color? do you observe contamination os discoloration in the area after
the mask has flaked off?))

From the asking of these questions one could safely assume I am attempting
to isolate a specific 'process' variable that would cause flaking mask...a
fabrication process...

From Scott's response, it appeared to be right out of the gate a "fab issue"
which is not always the case...too many times it is a "fab issue" (as
determined by assemblers) and the root cause not actually found...too often
most assembly issues become fab issues thus not focusing in on root assembly
causes. I was attempting to bring additional comments and perspectives into
the conversation in line with the intent of TechNet...

I've not seen any pictures as of yet so I cannot offer any information, as
far as I know no one else has either...and while I certainly realize that
most, most, thats most causes of flaking mask are the result of actions or
inaction on the part of the fabricator, is it in everyones best interest to
assume this is the case here?

Okay, enough rambling, got fabrication matters to address...(grin)

Franklin

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